In the fast-paced realm of semiconductor technology, where innovation is the norm and advancements occur at lightning speed, one component quietly but significantly drives the engine of progress: the Integrated Circuit (IC) substrate. As the backbone of electronic...
As product design becomes increasingly complex and time-to-market cycles shrink, OEMs are relying more than ever on the distribution channel to ensure they get the parts they need when they need them. Electronics distributors are stepping in to help find...
Instead of relying on a single source, it’s crucial to build a diverse network of suppliers to ensure supply continuity. The January earthquake in Japan greatly impacted passive component manufacturer Murata, causing lead times and pricing for fixed inductors to...
The future of semiconductors may rely less on the technology of the chips themselves and more on how they are packaged. As performance demands continue to grow, chipmakers are exploring new ways to squeeze more functionality into the same limited space. Chip packaging...
Factors like current market conditions, rising equipment costs, a lack of skilled workers, geopolitical tensions, and the slow rollout of government grants are causing delays in the construction of many planned fabs. Across the industry, stakeholders are grappling...
Engineers are turning to packaging substrates to optimize electronic devices in preparation for an era that relies heavily on big data and computationally enormous artificial intelligence algorithms. One specific branch of packaging substrate research aims to find a...
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