In the fast-paced realm of semiconductor technology, where innovation is the norm and advancements occur at lightning speed, one component quietly but significantly drives the engine of progress: the Integrated Circuit (IC) substrate. As the backbone of electronic...
Engineers are turning to packaging substrates to optimize electronic devices in preparation for an era that relies heavily on big data and computationally enormous artificial intelligence algorithms. One specific branch of packaging substrate research aims to find a...
Fabless OEMs are developing revolutionary ways to make semiconductor chips faster and smaller. Yet this drive for specialized, hyper-powerful miniaturized electronics presents challenges on the production end for OSAT business models. Profit and efficiency go...
Leadership Team
Industries We Serve
工作机会
Testing
BGA Reballing
缺货管理
停产料管理
Surplus Inventory Solutions
PPV Assessment
Quality Control Process
Vendor Qualification
Certifications & Affiliations
Case Studies
News & Events
Blog
Videos
Franchise Line Card
