The world now relies more than ever on data centers and 5G networks – significant drivers of demand for electronic parts. The more these industries grow, the more power they need. Manufacturers are turning to advanced power solutions to meet those challenges.
We’ve written before about next-generation products with node sizes smaller than 11 nm. Demand is increasing rapidly, particularly in applications for artificial intelligence, 5G, and data centers. These smaller nodes offer improved performance, increased power efficiency, and higher transistor density, making them ideal for uses that require high computational power in a small form factor. And as the demand for data increases, these industries will need more of these types of electronic components and more energy than ever before. To meet this challenge, designers must harness advanced power solutions to make energy transfer as efficient as possible. Here are some approaches they’re using.
The push for greater efficiency starts with optimizing for size, weight, and power (SWaP)
Inefficient power systems generate heat while in use. The more heat they produce, the more space and energy must be devoted to cooling systems like fans and heat sinks. Developing advanced power solutions that are more efficient, and thus produce less heat, is crucial to managing the growing 5G and data center industries. This not only makes power systems cheaper to operate, but also reduces the risk of failures from overheating. To maximize efficiency, designers strive to reduce size, weight, and power (SWaP) wherever possible. They use novel materials and techniques to optimize components for power management, saving space and energy.
Maximizing power density helps improve device performance
Data centers and 5G networks need advanced solutions that maximize power density, a measure of power output per unit volume. Making a device smaller while maintaining the same performance increases power density, making the device more efficient and cost-effective.
Designers are exploring a myriad of approaches to maximizing power density, such as:
- Innovative packaging to shrink device footprints
- Advanced integration and magnetics to increase power density
- Combining components to allow a smaller board area
- Incorporating novel materials that weigh less while still meeting performance requirements
Increased focus on minimizing noise will improve high-frequency switching
High-frequency switching is one way to meet the ever-increasing demand for power, because it can reduce the size and weight of passive devices like resistors, inductors, and capacitors. However, high-frequency switching comes with a drawback: it creates electromagnetic noise interference. This interference can disrupt highly sensitive devices like 5G transceivers. Shielding can be used to block interference, but this adds size and weight.
Designers are exploring creative ways to minimize interference. For example, a technique called zero-voltage switching produces less interference, allowing devices to operate at higher frequencies with less shielding. Less shielding means lower weight and smaller size.
Smarter power management strategies seek to decrease energy usage in off-peak hours
Another solution to data centers’ and 5G networks’ advanced power needs is automated or “smart” power management. Smart power systems monitor energy usage to determine peak and off-peak hours, power up servers when they’re needed, and shut them down when not in use. This way, data centers use only the power they need. Their servers don’t continue using energy during downtime, minimizing waste.
Data centers require a lot of energy—roughly 1% of the planet’s electricity usage—and this number will only increase as consumers and businesses demand more data. And we know the 5G network never sleeps—it is on and running 24/7, which also requires a lot of energy. What’s almost certain is that electronic parts that maximize efficiency, minimize size and noise, and provide the advanced power solutions needed will continue to be in high demand.
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